US Patent Issued to Intel on Sept. 9 for "Recessed vertical interconnects for device miniaturization" (Malaysian Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,784, issued on Sept. 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Recessed vertical interconnects for device miniaturization" was invented by Yee Lun Ong (Penang, Malaysia), Teong Guan Yew (Pulau Pinang, Malaysia), Bok Eng Cheah (Pulau Pinang, Malaysia) and Jackson Chung Peng Kong (Pulau Pinang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an electronic assembly including a package substrate with a first surface and an opposing second surface; a first interconnect disposed in the package substrate and extending between the first and the second surfaces; and a second interconnect disposed in the...