US Patent Issued to Intel on Sept. 9 for "Microelectronic assemblies including interconnects with different solder materials" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,868, issued on Sept. 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies including interconnects with different solder materials" was invented by Jeremy Ecton (Gilbert, Ariz.), Jason M. Gamba (Gilbert, Ariz.), Brandon C. Marin (Chandler, Ariz.), Srinivas V. Pietambaram (Chandler, Ariz.), Xiaoxuan Sun (Phoenix), Omkar G. Karhade (Chandler, Ariz.), Xavier Francois Brun (Hillsboro, Ore.), Yonggang Li (Chandler, Ariz.), Suddhasattwa Nad (Chandler, Ariz.), Bohan Shan (Tempe, Ariz.), Haobo Chen (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related ...