US Patent Issued to Intel on Sept. 30 for "Technologies for high throughput additive manufacturing for integrated circuit components" (American, Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,430, issued on Sept. 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Technologies for high throughput additive manufacturing for integrated circuit components" was invented by Yoshihiro Tomita (Tsukuba, Japan), Aleksandar Aleksov (Chandler, Ariz.), Feras Eid (Chandler, Ariz.), Adel Elsherbini (Chandler, Ariz.), Wenhao Li (Chandler, Ariz.) and Stephen Morein (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Technologies for high throughput additive manufacturing (HTAM) structures are disclosed. In one embodiment, a sacrificial dielectric is formed to provide a negative mask on which to pattern a conductive trace using HTAM. In...