ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,897, issued on Sept. 30, was assigned to Intel Corp. (Santa Clara, Calif.).
"Cooling approaches for stitched dies" was invented by Abhishek Anil Sharma (Portland, Ore.), Wilfred Gomes (Portland, Ore.), Christopher M. Pelto (Beaverton, Ore.), Mark C. Phillips (Portland, Ore.) and Swaminathan Sivakumar (Beaveton, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Stitched dies having a cooling structure are described. For example, an integrated circuit structure includes a first die including a first device layer and a first plurality of metallization layers over the first device layer. The integrated circuit structure also includes a second die inc...