US Patent Issued to Intel on Sept. 30 for "Compact form factor cooling assembly retention system" (Canadian, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,881, issued on Sept. 30, was assigned to Intel Corp. (Santa Clara, Calif.).

"Compact form factor cooling assembly retention system" was invented by Shahin Amiri (Richmond Hill, Canada), Mirui Wang (Oshawa, Canada), Saman Nasirahmadi (Newmarket, Canada), Ali Kalantarian (Richmond Hill, Canada) and Tejas Shah (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a bolt to be inserted through a first hole in a cooling mass, a second hole in a planar mechanical element and a third hole in an electronic circuit board when the first, second and third holes are aligned. The apparatus includes a fir...