US Patent Issued to Intel on Sept. 23 for "Technologies for isolated heat dissipating devices" (Chinese, American Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,513, issued on Sept. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Technologies for isolated heat dissipating devices" was invented by Prabhakar Subrahmanyam (San Jose, Calif.), Tong Wa Chao (San Jose, Calif.), Ying-Feng Pang (San Jose, Calif.), Yi Xia (Campbell, Calif.), Rahima K. Mohammed (San Jose, Calif.), Victor P. Polyanko (San Jose, Calif.), Ridvan A. Sahan (Sunnyvale, Calif.), Guangying Zhang (Shanghai), Guoliang Ying (Shanghai), Chuanlou Wang (Shanghai), Jun Lu (Shanghai), Liguang Du (Shanghai), Peng Wei (Shangha, China) and Xiang Que (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques for heat sinks and cold plat...