US Patent Issued to Intel on Sept. 23 for "Nested glass packaging architecture for hybrid electrical and optical communication devices" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,615, issued on Sept. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Nested glass packaging architecture for hybrid electrical and optical communication devices" was invented by Srinivas V. Pietambaram (Chandler, Ariz.), Brandon C. Marin (Chandler, Ariz.), Debendra Mallik (Chandler, Ariz.), Tarek A. Ibrahim (Mesa, Ariz.), Jeremy Ecton (Gilbert, Ariz.), Omkar G. Karhade (Chandler, Ariz.), Bharat Prasad Penmecha (Phoenix), Xiaoqian Li (Chandler, Ariz.), Nitin A. Deshpande (Chandler, Ariz.), Mitul Modi (Phoenix) and Bai Nie (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optoelectronic assembly is disclosed, comprising a sub...