US Patent Issued to Intel on Sept. 23 for "Fin shaping and integrated circuit structures resulting therefrom" (Oregon Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,299, issued on Sept. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Fin shaping and integrated circuit structures resulting therefrom" was invented by Szuya S. Liao (Portland, Ore.), Rahul Pandey (Hillsboro, Ore.), Rishabh Mehandru (Portland, Ore.), Anupama Bowonder (Portland, Ore.) and Pratik Patel (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Fin shaping, and integrated circuit structures resulting therefrom, are described. For example, an integrated circuit structure includes a semiconductor fin having a protruding fin portion above an isolation structure above a substrate. The protruding fin portion has substantially v...