US Patent Issued to Intel on Sept. 23 for "Contiguous shield structures in microelectronic assemblies having hybrid bonding" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,589, issued on Sept. 23, was assigned to Intel Corp. (Santa Clara, Calif.).

"Contiguous shield structures in microelectronic assemblies having hybrid bonding" was invented by Beomseok Choi (Chandler, Ariz.), Adel A. Elsherbini (Tempe, Ariz.), Han Wui Then (Portland, Ore.), Johanna M. Swan (Scottsdale, Ariz.) and Shawna M. Liff (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first microelectronic component, embedded in a first dielectric layer, including a surface and one or more side surf...