US Patent Issued to Intel on Sept. 2 for "Ultra-thin, hyper-density semiconductor packages" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,914, issued on Sept. 2, was assigned to Intel Corp. (Santa Clara, Calif.).

"Ultra-thin, hyper-density semiconductor packages" was invented by Debendra Mallik (Chandler, Ariz.), Robert L. Sankman (Phoenix), Robert Nickerson (Chandler, Ariz.), Mitul Modi (Phoenix), Sanka Ganesan (Chandler, Ariz.), Rajasekaran Swaminathan (Chandler, Ariz.), Omkar Karhade (Chandler, Ariz.), Shawna M. Liff (Scottsdale, Ariz.), Amruthavalli Alur (Tempe, Ariz.) and Sri Chaitra J. Chavali (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Ultra-thin, hyper-density semiconductor packages and techniques of forming such packages are described. An exemplary semicon...