US Patent Issued to Intel on Sept. 16 for "Microelectronic assemblies having backside die-to-package interconnects" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,978, issued on Sept. 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies having backside die-to-package interconnects" was invented by Adel A. Elsherbini (Tempe, Ariz.), Kimin Jun (Portland, Ore.), Shawna M. Liff (Scottsdale, Ariz.), Johanna M. Swan (Scottsdale, Ariz.) and Han Wui Then (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface, in a first layer, and including a first metallization stack at the f...