US Patent Issued to Intel on Sept. 16 for "Interconnect network for multi-tile system on chips" (California, Oregon Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,478, issued on Sept. 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interconnect network for multi-tile system on chips" was invented by Abhishek Reddy Pamu (El Dorado Hills, Calif.), Lakshminarayana Pappu (Folsom, Calif.), David J. Harriman (Portland, Ore.) and Ramadass Nagarajan (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus comprises a first tile comprising a first instance of a plurality of global endpoints and a first instance of a plurality of local networks comprising a plurality of local endpoints; and an interconnect network of the first tile to couple to an interconnect network of a second tile, the s...