US Patent Issued to Intel on Sept. 16 for "Integrated circuit device cooling using thermoresponsive materials" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,959, issued on Sept. 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit device cooling using thermoresponsive materials" was invented by Tsung-Yu Chen (Taoyuan, Taiwan) and Rebecca Shia (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit dies, systems, and techniques, are described herein related to efficient heat dissipation in integrated circuit implementations, such as three-dimensional packages, using integrated thermoresponsive materials. An integrated circuit die includes a thermoresponsive material in a via that extends through at least a portion of a device layer and one or more metal in...