ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,416,093, issued on Sept. 16, was assigned to Intel Corp. (Santa Clara, Calif.).
"Electroless plating process" was invented by Chandrasekharan Nair (Mesa, Ariz.), Darko Grujicic (Chandler, Ariz.), Rengarajan Shanmugam (Chandler, Ariz.), Srinivasan Raman (Chandler, Ariz.), Roy Dittler (Chandler, Ariz.), Daniel Sowa (Casa Grande, Ariz.), Robert Baresel II (Gilbert, Ariz.), Marcel Wall (Phoenix) and Rahul Manepalli (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to an electroless plating process using a panel basket for holding semiconductor panels comprising a plurality of metal pads and shielding the met...