US Patent Issued to Intel on Oct. 7 for "Simulating die rotation to minimize area overhead of reticle stitching for stacked dies" (California, Oregon Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,467, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Simulating die rotation to minimize area overhead of reticle stitching for stacked dies" was invented by Scott Siers (Elk Grove, Calif.), Satish Damaraju (El Dorado Hills, Calif.) and Christopher Pelto (Beaverton, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Compute complexes, base dies, and methods related to leveraging reticle stitching for improved device interconnects are discussed. A base die includes first and second regions having device layers, lower level metallization layers, and through vias fabricated using the same reticles. In the first region, a first sub...