ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,711, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.).
"Providing fine grain access to package memory" was invented by Abhishek Anil Sharma (Portland, Ore.), Wilfred Gomes (Portland, Ore.), Rajabali Koduri (Saratoga, Calif.) and Pushkar Ranade (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an integrated circuit package includes: a first die having a plurality of cores, each of the plurality of cores having a local memory interface circuit to access a local portion of a dynamic random access memory (DRAM); and a second die comprising the DRAM, where at least some of the plurality of cores are dir...