US Patent Issued to Intel on Oct. 7 for "Integrated circuit package redistribution layers with metal-insulator-metal (MIM) capacitors" (German Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,616, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit package redistribution layers with metal-insulator-metal (MIM) capacitors" was invented by David O'Sullivan (Neubiberg, Germany), Georg Seidemann (Landshut, Germany), Bernd Waidhas (Pettendorf, Germany) and Horst Baumeister (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "IC chip package routing structures including a metal-insulator-metal (MIM) capacitor integrated with redistribution layers. An active side of an IC chip may be electrically coupled to the redistribution layers through first-level interconnects. The redistribution layers terminate at i...