US Patent Issued to Intel on Oct. 7 for "Disaggregated die with input/output (I/O) tiles" (Indian, American Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,912, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Disaggregated die with input/output (I/O) tiles" was invented by Andrew Paul Collins (Chandler, Ariz.), Mahesh Krishnappayya Kumashikar (Bangalore, India) and Srikanth Nimmagadda (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments may relate to a microelectronic assembly including a substrate; a first die electrically coupled to the substrate, wherein the first die includes a first edge, a second edge, a third edge opposite the first edge, and a fourth edge opposite the second edge; and a second die electrically coupled to the substrate adjacent to the...