US Patent Issued to Intel on Oct. 7 for "Capacitor with an electrically conductive layer coupled with a metal layer of the capacitor" (Oregon, Washington Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,929, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Capacitor with an electrically conductive layer coupled with a metal layer of the capacitor" was invented by Chia-Ching Lin (Portland, Ore.), Kaan Oguz (Portland, Ore.), Sou-Chi Chang (Portland, Ore.), Arnab Sen Gupta (Hillsboro, Ore.), I-Cheng Tung (Hillsboro, Ore.), Ian A. Young (Olympia, Wash.), Matthew V. Metz (Portland, Ore.), Uygar E. Avci (Portland, Ore.) and Sudarat Lee (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein may be related to apparatuses, processes, and techniques related MIM capacitors that have a multiple trench s...