US Patent Issued to Intel on Oct. 28 for "Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,702, issued on Oct. 28, was assigned to Intel Corp. (Santa Clara, Calif.).

"Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets" was invented by Kimin Jun (Portland, Ore.), Feras Eid (Chandler, Ariz.), Adel Elsherbini (Tempe, Ariz.), Aleksandar Aleksov (Chandler, Ariz.), Shawna Liff (Scottsdale, Ariz.), Johanna Swan (Scottsdale, Ariz.) and Julien Sebot (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques and mechanisms for mitigating stress on hybrid bonded interfaces in a multi-tier arrangement of integrated circuit (IC) dies. In an embodiment, first dies are bonded at a host die...