US Patent Issued to Intel on Oct. 21 for "Integrated thermal solution to enable operation of embedded processors in sub-zero temperatures" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,399, issued on Oct. 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated thermal solution to enable operation of embedded processors in sub-zero temperatures" was invented by Ganesh Kondapuram (Chandler, Ariz.), Chetan Rawal (Chandler, Ariz.) and Kevin Connolly (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating t...