US Patent Issued to Intel on Oct. 14 for "Physical vapor deposition seeding for high aspect ratio vias in glass core technology" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,619, issued on Oct. 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Physical vapor deposition seeding for high aspect ratio vias in glass core technology" was invented by Veronica Strong (Hillsboro, Ore.), Aleksandar Aleksov (Chandler, Ariz.), Georgios C. Dogiamis (Chandler, Ariz.), Telesphor Kamgaing (Chandler, Ariz.) and Neelam Prabhu Gaunkar (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include package substrates and methods of fabricating such substrates. In an embodiment, a package substrate comprises a core with a first surface and a second surface opposite from the first surface. The pack...