US Patent Issued to Intel on Oct. 14 for "Hybrid bonding technologies with thermal expansion compensation structures" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,672, issued on Oct. 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Hybrid bonding technologies with thermal expansion compensation structures" was invented by Jeremy Ecton (Gilbert, Ariz.), Aleksandar Aleksov (Chandler, Ariz.), Hiroki Tanaka (Gilbert, Ariz.), Brandon Marin (Gilbert, Ariz.), Srinivas Pietambaram (Chandler, Ariz.) and Xavier Brun (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic integrated circuit package structures include a first substrate coupled to a second substrate by a conductive interconnect structure and a dielectric material adjacent to the conductive interconnect structure. A cavity in...