US Patent Issued to Intel on Nov. 4 for "Structure to transition between a transmission line conductor and a solder ball" (Israeli Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,121, issued on Nov. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Structure to transition between a transmission line conductor and a solder ball" was invented by Ariel Greenbaum (Petah Tikva, Israel) and Matan Pessach (Tel Aviv, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a semiconductor chip package substrate having a transmission line. The transmission line has a conductor to conduct current of a signal that is propagated along the transmission line. The conductor has an expanding width as the conductor approaches a vertical transition region. The vertical transition region is be...