US Patent Issued to Intel on Nov. 4 for "Packaging architectures for sub-terahertz radio frequency devices" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,156, issued on Nov. 4, was assigned to Intel Corp. (Santa Clara, Calif.).

"Packaging architectures for sub-terahertz radio frequency devices" was invented by Georgios Dogiamis (Chandler, Ariz.) and Adel A. Elsherbini (Tempe, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly is provided comprising: a first IC die in a first layer comprising an array of radio frequency (RF) patch antennas on a side opposite to a second layer; a second IC die in the second layer between the first layer and a third layer; and a third IC die in the third layer. The first IC die comprises RF and analog circuitry, the first IC die is part of an...