US Patent Issued to Intel on Nov. 25 for "Standard interfaces for die to die (D2D) interconnect stacks" (California Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,614, issued on Nov. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Standard interfaces for die to die (D2D) interconnect stacks" was invented by Debendra Das Sharma (Saratoga, Calif.), Swadesh Choudhary (Mountain View, Calif.), Narasimha Lanka (Dublin, Calif.), Zuoguo Wu (San Jose, Calif.), Gerald Pasdast (San Jose, Calif.) and Lakshmipriya Seshan (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a first die comprises: a first die-to-die adapter to communicate with first protocol layer circuitry via a flit-aware die-to-die interface (FDI) and first physical layer circuitry via a raw die-to-die interface (R...