US Patent Issued to Intel on Nov. 25 for "Hybrid backside thermal structures for enhanced ic packages" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,779, issued on Nov. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Hybrid backside thermal structures for enhanced ic packages" was invented by Feras Eid (Chandler, Ariz.), Joe Walczyk (Tigard, Ore.), Weihua Tang (Chandler, Ariz.), Akhilesh Rallabandi (Chandler, Ariz.) and Marco Aurelio Cartas Ayala (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) die structure comprises a substrate material comprising silicon. Integrated circuitry is over a first side of the substrate material. A composite layer is in direct contact with a second side of the substrate material. The second side is opposite the first...