US Patent Issued to Intel on Nov. 25 for "Ground via clustering for crosstalk mitigation" (Arizona, North Carolina Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,733, issued on Nov. 25, was assigned to Intel Corp. (Santa Clara, Calif.).

"Ground via clustering for crosstalk mitigation" was invented by Zhiguo Qian (Chandler, Ariz.), Kemal Aygun (Tempe, Ariz.) and Yu Zhang (Raleigh, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure are directed towards techniques and configurations for ground via clustering for crosstalk mitigation in integrated circuit (IC) assemblies. In some embodiments, an IC package assembly may include a first package substrate configured to route input/output (I/O) signals and ground between a die and a second package substrate. The first package s...