US Patent Issued to Intel on Nov. 18 for "Solder interconnect hierarchy for heterogeneous electronic device packaging" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,214, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Solder interconnect hierarchy for heterogeneous electronic device packaging" was invented by Yue Deng (Chandler, Ariz.), Jung Kyu Han (Chandler, Ariz.), Liang He (Chandler, Ariz.), Gang Duan (Chandler, Ariz.) and Rahul N. Manepalli (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A computer apparatus includes a hierarchy of solder joints in a multi-chip package, with solder joints at different levels of the packaging having different melting temperatures. Interconnections, such as pads or pins, on integrated circuit (IC) die can be electrically coupled to ends...