US Patent Issued to Intel on Nov. 18 for "Semiconductor chip package thermo-mechanical cooling assembly" (American, Mexican Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,167, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor chip package thermo-mechanical cooling assembly" was invented by Olaotan Elenitoba-Johnson (Tigard, Ore.), Eric Erike (Mesa, Ariz.), Jeffory L. Smalley (Olympia, Wash.), Ulises Encarnacion (Tlaquepaque, Mexico), Ralph V. Miele (Hillsboro, Ore.), Phil Geng (Washougal, Wash.), Sri Priyanka Tunuguntla (Portland, Ore.) and Shaun G. Immeker (Folsom, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster...