US Patent Issued to Intel on Nov. 18 for "Rectilinear seams between adjacent fields of a die for improved layout efficiency" (Oregon Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,205, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Rectilinear seams between adjacent fields of a die for improved layout efficiency" was invented by Kimberly Pierce (Beaverton, Ore.), Marni Nabors (Hillsboro, Ore.) and Mark Phillips (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices, systems, and methods are described related to providing nonlinear lithographic seams, such as rectilinear lithographic seams, between adjacent fields of an integrated circuit die. Such nonlinear lithographic seams include lithographic enabling structures formed in co-planar layers with respect to functional structures in fu...