ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,235, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.).
"Multi-chip packaging" was invented by Robert L. Sankman (Phoenix), Sairam Agraharam (Chandler, Ariz.), Shengquan Ou (Chandler, Ariz.), Thomas J De Bonis (Tempe, Ariz.), Todd Spencer (Chandler, Ariz.), Yang Sun (Chandler, Ariz.) and Guotao Wang (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of ...