ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,176, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.).
"Glass core substrate printed circuit board for warpage reduction" was invented by Carlton Hanna (San Jose, Calif.), Georg Seidemann (Landshut, Germany), Eduardo De Mesa (Munich), Abdallah Bacha (Munich) and Lizabeth Keser (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device comprises a first redistribution layer (RDL) including multiple sublayers of conductive traces formed in an organic material; a stiffening layer including one of a ceramic or glass, the stiffening layer including a first surface contacting a first surface of the first RDL and inc...