US Patent Issued to Intel on Nov. 18 for "Cooling systems with heat pipes for electronic devices" (American, Taiwanese, Indian Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,691, issued on Nov. 18, was assigned to Intel Corp. (Santa Clara, Calif.).

"Cooling systems with heat pipes for electronic devices" was invented by Juha Tapani Paavola (Hillsboro, Ore.), Christopher Moore (Warren, Ore.), Jeff Ku (Taipei, Taiwan) and Prakash Kurma Raju (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top w...