US Patent Issued to Intel on Nov. 11 for "Valid signal for latency sensitive die-to-die (D2D) interconnects" (California Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,597, issued on Nov. 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Valid signal for latency sensitive die-to-die (D2D) interconnects" was invented by Narasimha Lanka (Dublin, Calif.), Debendra Das Sharma (Saratoga, Calif.), Lakshmipriya Seshan (Sunnyvale, Calif.), Swadesh Choudhary (Mountain View, Calif.), Zuoguo Wu (San Jose, Calif.) and Gerald Pasdast (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein relate to a die of a multi-die package, wherein the die is coupled with another die via a die-to-die (D2D) interconnect link. The die may transmit a data signal to the other die via a data lane of the D2D int...