US Patent Issued to Intel on Nov. 11 for "Moisture seal coating of hybrid bonded stacked die package assembly" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,801, issued on Nov. 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Moisture seal coating of hybrid bonded stacked die package assembly" was invented by Debendra Mallik (Chandler, Ariz.), Mohammad Enamul Kabir (Portland, Ore.), Nitin Deshpande (Chandler, Ariz.), Omkar Karhade (Chandler, Ariz.), Arnab Sarkar (Chandler, Ariz.), Sairam Agraharam (Chandler, Ariz.), Christopher Pelto (Beaverton, Ore.), Gwang-Soo Kim (Portland, Ore.) and Ravindranath Mahajan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked die assemblies having a moisture sealant layer according to embodiments are described herein. A microelectronic package ...