US Patent Issued to Intel on Nov. 11 for "Inductor and transformer semiconductor devices using hybrid bonding technology" (Arizona, California, Oregon Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,630, issued on Nov. 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"Inductor and transformer semiconductor devices using hybrid bonding technology" was invented by Georgios Dogiamis (Chandler, Ariz.), Qiang Yu (Saratoga, Calif.), Adel Elsherbini (Tempe, Ariz.) and Kimin Jun (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for inductor and transformer semiconductor devices using hybrid bonding technology are disclosed. An example semiconductor device includes a first standoff substrate; a second standoff substrate adjacent the first standoff substrate; and a conductive layer adjacent at least one of the fir...