US Patent Issued to Intel on Nov. 11 for "High precision scalable packaging architecture based on radio frequency scanning" (Israeli, American Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,954, issued on Nov. 11, was assigned to Intel Corp. (Santa Clara, Calif.).

"High precision scalable packaging architecture based on radio frequency scanning" was invented by Georgios Dogiamis (Chandler, Ariz.), Alon Cohen (Modiin Macabim Reut, Israel) and Ophir Shabtay (Tzofit, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly comprise a plurality of transceiver modules, each transceiver module including a first antenna; a printed circuit board (PCB); and a reflector module coupled to the PCB and separated from the plurality of transceiver modules by a space. The reflector module comprises: a substrate h...