US Patent Issued to Intel on May 6 for "Integrated circuit structures including backside vias" (Oregon Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,003, issued on May 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit structures including backside vias" was invented by Nicholas A. Thomson (Hillsboro, Ore.), Kalyan C. Kolluru (Portland, Ore.), Adam Clay Faust (Portland, Ore.), Frank Patrick O'Mahony (Portland, Ore.), Ayan Kar (Portland, Ore.) and Rui Ma (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are integrated circuit (IC) structures including backside vias, as well as related methods and devices. In some embodiments, an IC structure may include: a device layer, wherein the device layer includes a plurality of active devices; a first me...