US Patent Issued to Intel on May 6 for "Gate-all-around integrated circuit structures having insulator substrate" (Oregon Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,006, issued on May 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Gate-all-around integrated circuit structures having insulator substrate" was invented by Chung-Hsun Lin (Portland, Ore.), Biswajeet Guha (Hillsboro, Ore.), William Hsu (Hillsboro, Ore.), Stephen Cea (Hillsboro, Ore.) and Tahir Ghani (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Gate-all-around integrated circuit structures having an insulator substrate, and methods of fabricating gate-all-around integrated circuit structures having an insulator substrate, are described. For example, an integrated circuit structure includes a semiconductor fin on an insulator ...