US Patent Issued to Intel on May 6 for "Boiling enhancement structures for immersion cooled electronic systems" (Chinese, Mexican, American, Taiwanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,956, issued on May 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Boiling enhancement structures for immersion cooled electronic systems" was invented by Jin Yang (Hillsboro, Ore.), Jimmy Chuang (Taipei, Taiwan), Xicai Jing (Shanghai), Yuan-Liang Li (Taipei, Taiwan), Yuyang Xia (Shanghai), David Shia (Portland, Ore.), Mohanraj Prabhugoud (Hillsboro, Ore.), Maria de la Luz Belmont (Zapopan, Mexico), Oscar Farias Moguel (Morelia, Mexico), Andres Ramirez Macias (Zapopan, Mexico), Javier Avalos Garcia (Zapopan, Mexico), Jessica Gullbrand (Hillsboro, Ore.), Shaorong Zhou (Shanghai), Chia-Pin Chiu (Tempe, Ariz.) and Xiaojin Gu (Shanghai Zizhu Science Park, China).

According to ...