ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,780, issued on May 27, was assigned to Intel Corp. (Santa Clara, Calif.).
"Technologies for processor loading mechanisms" was invented by Ralph V. Miele (Hillsboro, Ore.), Phil Geng (Washougal, Wash.), Mengqi Liu (Hillsboro, Ore.), David Shia (Portland, Ore.), Sandeep Ahuja (Portland, Ore.), Eric W. Buddrius (Hillsboro, Ore.) and Jeffory L. Smalley (Olympia, Wash.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the proces...