US Patent Issued to Intel on May 27 for "Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone" (Arizona Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,777, issued on May 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone" was invented by Elizabeth Nofen (Phoenix), Shripad Gokhale (Gilbert, Ariz.), Nick Ross (Chandler, Ariz.), Amram Eitan (Scottsdale, Ariz.), Nisha Ananthakrishnan (Chandler, Ariz.), Robert M. Nickerson (Chandler, Ariz.), Purushotham Kaushik Muthur Srinath (Chandler, Ariz.), Yang Guo (Chandler, Ariz.), John C. Decker (Tempe, Ariz.) and Hsin-Yu Li (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "...