US Patent Issued to Intel on May 27 for "Microelectronic assemblies" (Arizona Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,840, issued on May 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies" was invented by Shawna M. Liff (Scottsdale, Ariz.), Adel A. Elsherbini (Chandler, Ariz.) and Johanna M. Swan (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contact...