US Patent Issued to Intel on May 27 for "DIMM socket with seating floor to meet both longer length edge contacts and shorter length edge contacts" (Oregon Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,587, issued on May 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"DIMM socket with seating floor to meet both longer length edge contacts and shorter length edge contacts" was invented by Xiang Li (Portland, Ore.) and George Vergis (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a DIMM socket having a seating floor that is to meet both longer length contacts and shorter length contacts of a DIMM when the DIMM is fully seated in the socket."

The patent was filed on June 18, 2021, under Application No. 17/351,556.

*For further information, including images, charts and tables, ...