ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,966, issued on May 20, was assigned to Intel Corp. (Santa Clara, Calif.).
"Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force" was invented by Jin Yang (Hillsboro, Ore.), Jimmy Chuang (Taipei, Taiwan), Mengqi Liu (Hillsboro, Ore.), Phil Geng (Washougal, Wash.), Ralph V. Miele (Hillsboro, Ore.), Sandeep Ahuja (Portland, Ore.) and David Shia (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package...