ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,299, issued on May 20, was assigned to Intel Corp. (Santa Clara, Calif.).
"TEC-embedded dummy die to cool the bottom die edge hotspot" was invented by Chia-Pin Chiu (Tempe, Ariz.), Zhimin Wan (Chandler, Ariz.), Peng Li (Chandler, Ariz.) and Deepak Goyal (Phoenix).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include thermoelectric cooling (TEC) dies for multi-chip packages. In an embodiment, a TEC die comprises a glass substrate and an array of N-type semiconductor vias and P-type semiconductor vias through the glass substrate. In an embodiment, conductive traces are over the glass substrate, and individual ones of the c...