US Patent Issued to Intel on May 20 for "Radiation shield and groove in support structure" (Malaysian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,984, issued on May 20, was assigned to Intel Corp. (Santa Clara, Calif.).

"Radiation shield and groove in support structure" was invented by Boon Ping Koh (Penang, Malaysia), Twan Sing Loo (Penang, Malaysia), Yew San Lim (Penang, Malaysia) and Tin Poay Chuah (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation ...