US Patent Issued to Intel on May 20 for "Magnetically secured semiconductor chip package loading assembly" (Washington, Oregon Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,933, issued on May 20, was assigned to Intel Corp. (Santa Clara, Calif.).

"Magnetically secured semiconductor chip package loading assembly" was invented by Phil Geng (Washougal, Wash.), Timothy Glen Hanna (Tigard, Ore.), Xiaoning Ye (Portland, Ore.), Sandeep Ahuja (Portland, Ore.), Jacob McMillian (Beaverton, Ore.), Ralph V. Miele (Hillsboro, Ore.), David Shia (Portland, Ore.) and Jeffory L. Smalley (Olympia, Wash.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanical...