US Patent Issued to Intel on May 20 for "Integrating and accessing passive components in wafer-level packages" (German Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,335, issued on May 20, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrating and accessing passive components in wafer-level packages" was invented by Gianni Signorini (Garching bei Munich, Germany), Veronica Sciriha (Munich) and Thomas Wagner (Regelsbach, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "In accordance with disclosed embodiments, there is a method of integrating and accessing passive components in three-dimensional fan-out wafer-level packages. One example is a microelectronic die package that includes a die, a package substrate attached to the die on one side of the die and configured to be connected to a system boar...